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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology

Year : 1993 Volume number : 16 Issue: 08

Evaluation Of A Three-Dimensional Memory Cube System (Article)
Subject: Evaluation , Three Cube , Memory
Author: Claude L. Bertin      David J. Perlman      Stuart N. Shanken     
page:      1006 - 1011
A Study On Insertion Loss Improvement For An Optical Connector Using The Analysis Of Transmitted Optical Intensity (Article)
Subject: Study Of The Mixing , Optical , Optical Internet
Author: Oh-Gone Chun      Myung-Yung Jeong      Tae-Goo Choy     
page:      768 - 777
Packaging And Reliability Of Photonic Components For Subscriber Network Systems (Article)
Subject: Packaging , Reliability , Network Synthesis
Author: Junji Yoshida      Masanori Yamada      Hiroshi Terui     
page:      778 - 782
High Performance Optical Datalink Array Technology (Article)
Subject: High Performance , Optical , Array
Author: Ronald A. Nordin      D. Bruce Buchholz      Nagesh R. Basavanhally     
page:      783 - 788
Directly Deposited Fluxless Lead Indium Gold Composite Solder (Article)
Subject: Lead -Free , Gold , Composite
Author: Chen Y. Wang      C H Lee      Y M Chen     
page:      789 - 793
Creep Of Solder Interconnects Under Combined Loads (Article)
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page:      794 - 798
Effect Of Post Reflow No Clean Solder Paste Residue On Electrical Performance (Article)
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page:      799 - 801
Application Of Quality Function Deployment To The Design Of A Lithium Battery (Article)
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page:      802 - 807
Fine Pitch Tab Assembly Technology For 820 Pin Count Ceramic Pga Using Single Point Bonding Technology At Room Temperature (Article)
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page:      808 - 816
Fabrication Of Thin-Film Multilayer Substrate Using Copper Clad Polyimide Sheets (Article)
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page:      817 - 821
Evaluation Of Tumblin Processes Of Multilayer Ceramic Capacitors For Surface Mount Device Applications (Article)
Subject:
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page:      822 - 827
An Overviw And Evaluation Of Anistropically Conductive Adhesive Films For Fine Pitch Electronic Assembly (Article)
Subject: Overview , Evaluation , Pitch Accent , Conductive Adhesive
Author: David C Chang      Graham B. Mcbride      C. P. Wong     
page:      828 - 835
Accelerated Life Test Of Z-Axis Conductive Adhesives (Article)
Subject: Accelerated Life Test , Conductive Adhesive
Author: D. D. Chang      J. A. Fulton      C. P. Wong     
page:      836 - 842
Electrical, Structural And Processing Properties Of Electrically Conductive Adhesives (Article)
Subject: Structural , Processing , Conductive Adhesive
Author: Li Li. Christine      Gabsoo Kim      James E. Morris     
page:      843 - 851
A Fine Pitch Cog Technique For A Tft-Lcd Panel Using An Indium Alloy (Article)
Subject: Fine Aggregate , Panel , Indium
Author: Miki Mori      Yukio Kizaki      Akinori Hongu     
page:      852 - 857
Encapsulants Used In Flip-Chip Packages (Article)
Subject: Encapsulant , Flip-Chip , Packaging
Author: Darbha Suryanarayana      Tien H. Wu      Jack A. Varcoe     
page:      858 - 862
Encapsulant For Fatigue Life Enhancement Of Controlled-Collapse Chip Connection C4 (Article)
Subject: Encapsulant , Enhancement , Controlled Atmosphere
Author: David W. Wang      Kostas I. Papathomas     
page:      863 - 867
Robust Titanate-Modified Encapsulants For High Voltage Potting Application Of Multichip Module Hybrid Ic (Article)
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page:      868 - 875
Rigorous Electromagnetic Modeling Of Chip-To-Package First-Level Interconnections (Article)
Subject: Rigorous Dynamic Model , Modeling , Chip-To-Chip Interconnects
Author: Y. G Tsuei      Andreas C. Cangellaris      John L. Prince     
page:      876 - 883
A Package Analysis Tool Based On A Method Of Moments Surface Formulation (Article)
Subject: Package Modeling , Tool Design , Surface
Author: Saila Ponnapalli      Robert Bertin      Alina Deutsch     
page:      884 - 892
An 820 Pin Pga For Ultralarge-Scale Bicmos Devices (Article)
Subject: Pga , Ultralarge Scale Integration , Devices
Author: Yoichi Hiruta      Akihiko Hirano      Toshio Sudo     
page:      893 - 901
Development Of A Cost-Effective High-Performance Metal Qfp Packaging System (Article)
Subject: Development , Cost-Effective , Metal Powder
Author: Deepak Mahulikar      Anthony Pasqualoni      Jeffrey S. Braden     
page:      902 - 908
Investigation Of Plasma Effects On Plastic Packages Delamination And Cracking (Article)
Subject: Investigation , Plastic , Delamination
Author: Frank Djennas      Yushi Matsuda     
page:      919 - 918
Off-Axis Sensor Rosettes For Measurement Of The Piezoresistive Coefficients Of Silicon (Article)
Subject: Sensor , Measurement , Piezoresistance Coefficients
Author: Richard C. Jaeger      Malachy Carey      R. Wayne Johnson     
page:      925 - 931
Effect Of Material Interactions During Thermal Shock Testing On Ic Package Reliability (Article)
Subject: Effect Of Material , During The Last Two Decades , Reliability
Author: Luu T. Nguyen      Andrea S. Chen      Stephen A. Gee     
page:      932 - 939
Model And Analyses For Solder Reflow Cracking Phenomenon In Smt Plastic Packages (Article)
Subject: Model And Analysis , Smt , Package Modeling
Author: Gams S. Ganesan      Howard M. Berg     
page:      940 - 948
A Comprehensive Surfac Mount Reliability Model Covering Several Generations Of Packaging And Assembly Tecenology (Article)
Subject: Assembly Election , Comprehensive Design , Covering Ratio
Author: Jean-Paul Clech      John C. Manock     
page:      949 - 960
Attachment Reliability Evaluation And Failure Analysis Of Thin Small Outline Packages (Tsop'S) With Alloy 42 Leadframes (Article)
Subject: Attachment , Failure Analysis , Leadframes
Author: Donna M. Noctor      Franl E. Bader      Richard Foehringer     
page:      961 - 971
Anisotropically Conductive Polymer Films With A Uniform Dispersion Of Particles (Article)
Subject: Anisotropic , Polymer Filtration , Uniform Approximation
Author: Sungho Jin      Thomas H. Tiefel      Donald W. Dahringer     
page:      972 - 977
Interactive Thermal Modeling Of Electronic Circuit Boards (Article)
Subject: Interacting , Modeling , Electronic - Circuits
Author: William . Godfrey      Kaveh A. Tagavi      M. Pinar Menguc     
page:      978 - 985
Correlation Of Analytical And Experimental Approaches To Determine Thermally Induced Pwb Warpage (Article)
Subject: Correlation , Experimental , Determine Layer
Author: Chun-Ping Yeh      C. A Fulton      John W. Stafford     
page:      986 - 995
Physical Design Alternatives For Risc Workstation Packaging (Article)
Subject: Physical Design , Alternative Index , Packaging
Author: D. E. O'Brien      J. Peter Krusius      B. M. Hahne     
page:      996 - 1005